Unitized Semiconductor Devices
MHQ3725
Plastic inclosure material, 0.660 inches minimum and 0.785 inches maximum overall length, 0.200 inches maximum overall height, 0.290 inches minimum and 0.310 inches maximum overall width, 4 transistor component name and quantity, press fit mounting method
| DAC | HCC | DMIL | RNCC |
|---|---|---|---|
| 5 | - | - | 5 |
| RNVC | SADC | MSDS | RNAAC |
|---|---|---|---|
| 9 | - | - | TX |
Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes:devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes:network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.
| INC | FIIG | Concept | Condition |
|---|---|---|---|
| 61962 | A110A0 | - | 1 |
Details
The element,compound,or mixture of which the inclosure is fabricated,excluding any surface treatment. please use mrc cqsj in place of this discontinued mrc.Details
The dimension measured along the longitudinal axis with terminated points at the extreme ends of the item.Details
The distance measured in a straight line from the bottom to the top of an item.Details
An overall measurement taken at right angles to the length of an item,in distinction from thickness.Details
The name and number of components included.Details
The means of attaching the item.Details
Those features,not otherwise specified,which may be required for proper functioning of the item.Details
The chemical compound or mechanical mixture properties of which the semiconductor is fabricated.Details
The value of the voltage that may be applied,expressed in volts,and the symbol used to identify the specific electrical characteristic.Details
The level of electrical flow and the symbol used to identify the specific electrical characteristic.Details
The amount of electrical power that can be dissipated and the specific electrical characteristic.Details
The maximum temperature at which the item is designed to operate at each measurement point.Details
Those unusual or unique characteristics or qualities of an item not covered in the other requirements and which are determined to be essential for identification on one or more other functions.Details
Indicates the type and number of terminals for providing electrical connection.| Part | CAGE | DAC | HCC | RNCC | RNVC | MSDS | RNAAC |
|---|---|---|---|---|---|---|---|
| 012072-1 | 17981 | 1 | - | 3 | 9 | - | TX |
| 0N370487-1 | 98230 | 6 | - | C | 1 | - | ZZ |
| HMIC | PMIC | ESD/EMI | Criticality |
|---|---|---|---|
| N | U | B | - |
| UFC | HMC | LTL | LCL |
|---|---|---|---|
| 34525 | - | W | - |
| RVC | WCC | TCC | SHC |
|---|---|---|---|
| - | 72D | 3 | 9 |
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What is the NIIN of the NSN 5961-00-430-6884?
When the NSN 5961-00-430-6884 was assigned to the Federal Catalog?
Does the NSN 5961-00-430-6884 contain any precious metals?
Does the NSN 5961-00-430-6884 contain any hazardous material?
What is the ESD classification of NSN 5961-00-430-6884?
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