Thyristor Semiconductor Device
38800002
Junction contact internal configuration, silicon semiconductor material
DAC | HCC | DMIL | RNCC |
---|---|---|---|
6 | - | - | 3 |
RNVC | SADC | MSDS | RNAAC |
---|---|---|---|
2 | - | - | CL |
A bistable semiconductor device comprising three or more junctions which is normally a nonconductor until the application of a signal to a gate terminal, at which time the device switches to the conductive state. Includes devices capable of being switched back to the nonconductive state upon application of a different signal to the same or another gate terminal. May or may not include mounting hardware and/or heatsink. For solid state devices which are responsive to visible or infrared radiant energy, see semiconductor device, photo.
INC | FIIG | Concept | Condition |
---|---|---|---|
33096 | A110A0 | 1 | 1 |
Details
An indication of the internal basic form of the item.Details
The chemical compound or mechanical mixture properties of which the semiconductor is fabricated.HMIC | PMIC | ESD/EMI | Criticality |
---|---|---|---|
N | A | A | - |
UFC | HMC | LTL | LCL |
---|---|---|---|
34525 | - | W | W |
RVC | WCC | TCC | SHC |
---|---|---|---|
1 | 72D | Z | 9 |
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What is the NIIN of the NSN 5961-00-014-1237?
When the NSN 5961-00-014-1237 was assigned to the Federal Catalog?
Does the NSN 5961-00-014-1237 contain any precious metals?
Does the NSN 5961-00-014-1237 contain any hazardous material?
What is the ESD classification of NSN 5961-00-014-1237?
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